Tandans nan devlopman nan adezif fonn cho

2021/03/06

Adhésifs fonn cho yo te disponib pou syèk, sepandan,adezif fonn choki baze sou Polymers sentetik pa t 'kòmanse parèt sou mache a jouk nan ane 1950 yo. Pwodiksyon anyèl nan mond lan nan adhésifs hotmelt te sou yon tandans anwo, ki gen plis andmore varyete divèsifye ak aplikasyon pou pi laj.

        Since 1988, the world production index of adezif fonn cho has been higher than that of solvent-based adhesives and water-based adhesives. Hot melt adhesive has the advantages of pollution-free, suitable for automated production lines, fast operation speed and low cost. It is gradually replacing various traditional bonding methods or adhesives, and has received more attention. The performance of hot melt adhesives is gradually improved and improved through grafting modification, blending modification and reaction curing technologies. New varieties and new processes of adezif fonn cho are also constantly developing, showing a bright future.